SOFTFLEX-B016-30-01-0762-0762

The SOFTFLEX-B016-30-01-0762-0762 from Aavid, Thermal Division of Boyd Corporation delivers military-grade Thermal - Pads, Sheets solutions for harsh environment electronics. This extreme-duty thermal interface material meets MIL-STD-810 requirements while providing reliable thermal management for defense and aerospace systems.As a MIL-spec Gap Filler Pad, Sheet, this product combines extreme temperature stability with vibration resistance. The specially formulated matrix withstands 50G mechanical shock while maintaining perfect thermal contact.Precision-manufactured in Square configurations, this material meets tight military tolerances. The laser-cut edges ensure perfect fitment in ruggedized enclosures with strict dimensional requirements.With 76.20mm x 76.20mm dimensions, this solution accommodates standard military electronic packaging. The size-optimized design allows for efficient thermal management in space-constrained armored vehicles and aircraft systems.Featuring ultra-tight 0.118" (3.00mm) tolerances ( 0.01mm), this material ensures reliable interface contact under vibration. The controlled compression characteristics maintain optimal thermal transfer in dynamic environments.Formulated with mil-spec Silicone, this pad exhibits exceptional resistance to fuels and hydraulic fluids. This property ensures long-term reliability in engine compartments and weapons systems.Featuring Adhesive - One Side properties, this solution offers instant bonding in field repair situations. The high-tack formulation ensures immediate attachment even in dusty or oily conditions.The Polyethylene-Terephthalate (PET) system meets military handling requirements. This reinforced backing survives rough handling during field installation while preventing material contamination.The Black-Gray coding system complies with military identification standards. This standardized coloring facilitates quick material verification during field maintenance operations.Delivering 1.6W/m-K performance, this material enables effective cooling in armored electronics. The anisotropic properties provide directional heat flow for targeted cooling of high-power components.