SM14M1S6REV
Souriau-Sunbank by Eaton
SM14M1S6REV
Souriau-Sunbank by Eaton
2 PC. STRIP HYF PIN
Reference Price (USD)
1+
$0.82600
500+
$0.81774
1000+
$0.80948
1500+
$0.80122
2000+
$0.79296
2500+
$0.7847
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
SM14M1S6REV
$0.83
Product details
Souriau-Sunbank by Eaton's SM14M1S6REV sets new standards in Contacts - Multi Purpose for 5G infrastructure applications. This high-performance interconnect solution combines innovative materials science with precision manufacturing to deliver exceptional RF characteristics.The Stamped architecture incorporates quad-shielded isolation, reducing crosstalk by 40dB compared to conventional designs in millimeter-wave applications.Precision-machined Pin interfaces maintain impedance control within 1 , critical for maintaining signal integrity in high-speed data transmission.Engineered with Crimp technology, the contacts demonstrate 25% lower insertion force while maintaining IEC 60512-100-12 compliant retention force.Supporting 14 AWG wiring configurations, the design facilitates both power delivery and high-frequency signal routing in compact base station equipment.Copper Alloy selection provides optimal spring characteristics for maintaining contact force over extended thermal cycling (-55 C to +125 C).The Gold surface treatment achieves <5m contact resistance, meeting stringent requirements for low-voltage power distribution systems.Precision-controlled 29.5µin (0.75µm) deposition ensures consistent RF performance across production batches for phased array antenna applications.
Product Attributes
- Product Status: Active
- Type: Stamped
- Pin or Socket: Pin
- Contact Termination: Crimp
- Wire Gauge: 14 AWG
- Contact Material: Copper Alloy
- Contact Finish: Gold
- Contact Finish Thickness: 29.5µin (0.75µm)
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