SLB9670XQ12FW640XUMA1
Infineon Technologies
Product details
Infineon Technologies's SLB9670XQ12FW640XUMA1 redefines performance standards in Embedded - Microcontrollers - Application Specific, specifically developed for next-generation IoT edge nodes. This application-specific microcontroller combines ultra-low power consumption with robust security features, making it ideal for distributed sensor networks and smart city infrastructure.Designed for Trusted Platform Module (TPM) implementations, the microcontroller's hardware security modules exceed FIPS-140-2 requirements. Its tamper-resistant design includes active shield technology for physical attack prevention.The Surface Mount option supports reflow profiles compatible with lead-free SAC305 solder. Package warpage is controlled to <0.05mm for high-yield assembly processes.Available in 32-VFQFN Exposed Pad format, the package incorporates stress-relief features for improved board-level reliability. Moisture sensitivity meets JEDEC J-STD-020D Level 3 standards.Supplied in PG-VQFN-32-13 configuration, each unit includes unique cryptographic identifiers for supply chain authentication. Tape-and-reel packaging supports automated pick-and-place assembly.
Product Attributes
- Product Status: Discontinued at Digi-Key
- Applications: Trusted Platform Module (TPM)
- Core Processor: -
- Program Memory Type: -
- Controller Series: -
- RAM Size: -
- Interface: -
- Number of I/O: -
- Voltage - Supply: -
- Operating Temperature: -
- Mounting Type: Surface Mount
- Package / Case: 32-VFQFN Exposed Pad
- Supplier Device Package: PG-VQFN-32-13