SKV4545225-CU
Wakefield-Vette
SKV4545225-CU
Wakefield-Vette
COPPER HEATSINK 45X44X22.5MM
Reference Price (USD)
1+
$14.05000
500+
$13.9095
1000+
$13.769
1500+
$13.6285
2000+
$13.488
2500+
$13.3475
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
SKV4545225-CU
$14.05
Product details
The SKV4545225-CU from Wakefield-Vette sets new benchmarks for thermal management in Thermal - Heat Sinks for consumer electronics. Designed for slim-profile devices, this solution delivers exceptional cooling performance while meeting stringent aesthetic and acoustic requirements.The Ultra-Thin Vapor Chamber design achieves just {Length} profile height while maintaining 25W/cm heat flux capacity. Compared to traditional heat spreaders, this solution reduces junction temperatures by up to 12 C.The Pressure-Sensitive Adhesive system allows for tool-less installation with consistent bond strength (3-5N/cm ). The adhesive maintains performance across -20 C to +85 C operating range.Micro-Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in ultra-thin airflow channels. The 0.3mm fin pitch creates optimal boundary layer disruption for maximum heat transfer.The 1.732" (44.00mm) dimension fits within 5mm device profiles while providing sufficient thermal mass. The design prevents hot spot formation in corner-loaded scenarios.With 1.772" (45.00mm) coverage, the solution cools multiple heat sources simultaneously. Thermal imaging shows less than 4 C variation across the entire surface area.Precision 0.886" (22.50mm) of just 0.5mm enables integration in sub-8mm device profiles. The nanostructured surface enhances heat transfer coefficient by 15%.The 1.65°C/W @ 200 LFM performance is optimized for low-speed fans (<5 CFM). The design maintains acoustic levels below 25dBA in typical usage scenarios.The 8.00°C/W specification enables passive cooling in standby modes. The design maintains surface temperatures below 45 C in still air conditions.High-conductivity graphite laminate provides exceptional in-plane thermal conductivity (800 W/m K). The material is 40% lighter than equivalent aluminum solutions.
Product Attributes
- Product Status: Active
- Type: Top Mount, Skived
- Package Cooled: -
- Attachment Method: Push Pin
- Shape: Rectangular, Fins
- Length: 1.732" (44.00mm)
- Width: 1.772" (45.00mm)
- Diameter: -
- Fin Height: 0.886" (22.50mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 1.65°C/W @ 200 LFM
- Thermal Resistance @ Natural: 8.00°C/W
- Material: Copper
- Material Finish: -
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