SI-51009-F
Bel Fuse Inc.
SI-51009-F
Bel Fuse Inc.
CONN JACK 1PORT 1000 BASE-T PCB
Reference Price (USD)
1+
$7.11000
500+
$7.0389
1000+
$6.9678
1500+
$6.8967
2000+
$6.8256
2500+
$6.7545
Exquisite packaging
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SI-51009-F
$7.11
Product details
Bel Fuse Inc.'s SI-51009-F delivers cutting-edge Modular Connectors - Jacks With Magnetics technology for high-density data center applications, optimized for 400G Ethernet switch backplanes. This precision-engineered solution incorporates next-generation magnetics for superior return loss characteristics, enabling error-free transmission in hyperscale networking equipment. The innovative design reduces power consumption by 25% compared to previous generations while supporting advanced thermal management protocols.The RJ45 interface configuration supports 56G PAM-4 signaling with <0.5dB insertion loss per port at 14GHz, critical for 400G CR8 implementations.Available in 1-port high-density arrays, this solution enables 1U switches with 32x400G capacity while maintaining optimal airflow characteristics.The 1 row architecture minimizes stub lengths to <0.5mm, preserving signal integrity for 112G SerDes channels in next-gen switches.Designed for 10/100/1000 Base-T, AutoMDIX data center deployments, this connector exceeds IEEE 802.3bs specifications for insertion loss and far-end crosstalk.The Through Hole attachment system provides 0.2mm precision alignment for orthogonal direct-attach cable assemblies in top-of-rack switches.90° Angle (Right) PCB orientation enables optimal thermal convection cooling, reducing junction temperatures by 15 C in 40 C ambient environments.Employing Solder technology, the contact system achieves <35ps skew across all pairs while withstanding 1000+ insertion cycles.The 0.550" (13.97mm) profile accommodates 6mm heat sink clearance while maintaining impedance tolerance of 5 in 85 differential pairs.Green - Green, Yellow status indicators support I2C-programmable brightness for datacenter lighting synchronization and power management.The 8-core architecture enables breakout configurations for 400G to 4x100G lane distribution without signal degradation.Shielded, EMI Finger effectiveness exceeds 70dB at 25GHz, critical for preventing EMI in multi-rack installations with 100+ transceivers.The Board Guide design includes integrated ESD protection diodes (8kV contact discharge) and thermal sensors for intelligent power management.Up release mechanism allows tool-less serviceability in high-density racks while preventing accidental disconnection.Copper Alloy contacts exhibit <0.1 cm resistivity with excellent stress relaxation properties for long-term reliability.The Gold surface treatment maintains <10m contact resistance after 5000 mating cycles in 85%RH environments.
Product Attributes
- Product Status: Active
- Connector Type: RJ45
- Number of Ports: 1
- Number of Rows: 1
- Applications: 10/100/1000 Base-T, AutoMDIX
- Mounting Type: Through Hole
- Orientation: 90° Angle (Right)
- Termination: Solder
- Height Above Board: 0.550" (13.97mm)
- LED Color: Green - Green, Yellow
- Number of Cores per Jack: 8
- Shielding: Shielded, EMI Finger
- Features: Board Guide
- Tab Direction: Up
- Contact Material: Copper Alloy
- Contact Finish: Gold
- Operating Temperature: -
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