SEI-130-02-G-S-E-AB
Samtec Inc.
SEI-130-02-G-S-E-AB
Samtec Inc.
CONN SPRING MOD 30POS SMD
Reference Price (USD)
1+
$12.20000
500+
$12.078
1000+
$11.956
1500+
$11.834
2000+
$11.712
2500+
$11.59
Exquisite packaging
Discount
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SEI-130-02-G-S-E-AB
$12.20
Product details
The SEI-130-02-G-S-E-AB from Samtec Inc. represents a breakthrough in Rectangular Connectors - Spring Loaded technology for high-performance computing infrastructure, offering unparalleled signal integrity for data center applications.Utilizing Compression Contact, Non-Gendered architecture, this solution provides 100 impedance matching for 112G PAM4 signaling in next-generation server backplanes.The 30 contact array supports PCIe Gen5 and CXL protocols with minimal insertion loss for AI accelerator modules.Precision 0.039" (1.00mm) pitch configuration enables 56Gbps NRZ signaling while maintaining crosstalk below -40dB in switch fabric applications.With 1 rows of shielded differential pairs, this design minimizes simultaneous switching noise in GPU clusters.The Surface Mount interface incorporates thermal management features for high-power CPU sockets in hyperscale data centers.Low-loss Phosphor Bronze dielectric maintains signal integrity up to 50GHz for optical transceiver interconnects.Advanced Gold plating technology reduces skin effect losses at millimeter-wave frequencies.The 10.0µin (0.25µm) gold layer is optimized for both DC resistance and high-frequency performance in server applications.
Product Attributes
- Product Status: Active
- Connector Type: Compression Contact, Non-Gendered
- Number of Contacts: 30
- Pitch: 0.039" (1.00mm)
- Number of Rows: 1
- Row Spacing: -
- Mounting Type: Surface Mount
- Material: Phosphor Bronze
- Contact Finish: Gold
- Contact Finish Thickness: 10.0µin (0.25µm)
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