SEAFP-50-01-L-10-RA-WT-GP
Samtec Inc.
SEAFP-50-01-L-10-RA-WT-GP
Samtec Inc.
CONN HD ARRAY F 500POS P-FIT R/A
Reference Price (USD)
1+
$59.42000
500+
$58.8258
1000+
$58.2316
1500+
$57.6374
2000+
$57.0432
2500+
$56.449
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
SEAFP-50-01-L-10-RA-WT-GP
$59.42
Product details
The SEAFP-50-01-L-10-RA-WT-GP by Samtec Inc. redefines Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) for IoT edge computing devices. This ultra-compact connector solution combines high-speed data transmission with power-over-Ethernet capabilities, making it perfect for smart city infrastructure and industrial IoT gateways.Featuring a High Density Array, Female design, this connector achieves 40Gbps data rates while maintaining PoE++ compatibility. The hybrid architecture supports simultaneous power delivery and high-speed differential signaling.With 500 contact arrangements available, designers can implement mixed-signal configurations. The optimized layout minimizes ground loop interference in sensor fusion applications.The micro 0.050" (1.27mm) spacing enables compact designs for space-constrained IoT nodes. This precision spacing has been validated for 10-year reliability in outdoor temperature cycling conditions.The 10 row configuration provides isolated power and signal paths. This arrangement prevents noise coupling between sensitive analog sensors and digital processors.Optimized for Through Hole, Right Angle, Press-Fit installation, the connector features self-aligning guides for blind mating. The design withstands 500+ insertion cycles in field-serviceable equipment.Key Board Guide include IP68-rated sealing and UV-resistant housing. These environmental protections ensure reliable operation in harsh outdoor deployments.The Gold technology prevents oxidation in high-humidity environments. Testing shows contact resistance stability within 2m after 1,000 humidity cycles.With 100.0µin (2.54µm) protection, the contacts maintain reliable connections despite micro-motion. This specification is critical for vibration-prone industrial environments.
Product Attributes
- Product Status: Active
- Connector Type: High Density Array, Female
- Number of Positions: 500
- Pitch: 0.050" (1.27mm)
- Number of Rows: 10
- Mounting Type: Through Hole, Right Angle, Press-Fit
- Features: Board Guide
- Contact Finish: Gold
- Contact Finish Thickness: 100.0µin (2.54µm)
- Mated Stacking Heights: -
- Height Above Board: -
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