SEAFP-30-01-S-10-RA-WT-GP
Samtec Inc.
SEAFP-30-01-S-10-RA-WT-GP
Samtec Inc.
CONN HD ARRAY F 300POS P-FIT R/A
Reference Price (USD)
1+
$45.50000
500+
$45.045
1000+
$44.59
1500+
$44.135
2000+
$43.68
2500+
$43.225
Exquisite packaging
Discount
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SEAFP-30-01-S-10-RA-WT-GP
$45.50
Product details
Samtec Inc.'s SEAFP-30-01-S-10-RA-WT-GP delivers military-grade reliability for Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) applications in aerospace and defense systems. This MIL-DTL-83513 compliant connector withstands extreme environmental conditions while maintaining signal integrity in mission-critical applications.The High Density Array, Female configuration meets stringent MIL-STD-901D shock requirements for naval applications. The hermetic sealing technology prevents moisture ingress in submerged conditions.With 300 contact options, the connector supports complex avionics architectures. The redundant power contacts are designed for fault-tolerant systems in aircraft applications.The vibration-resistant 0.050" (1.27mm) spacing maintains contact alignment during high-G maneuvers. The design has been qualified for 500+ hours of salt fog exposure per MIL-STD-810G.The 10 row configuration provides optimal EMI shielding for sensitive radar systems. This layout has been optimized for impedance control in RF applications up to 6GHz.Engineered for Through Hole, Right Angle, Press-Fit installation in military electronics, the connector features anti-vibration locking mechanisms. The mounting system survives 15G random vibration per MIL-STD-167.Critical Board Guide include EMP hardening and radiation-resistant materials. These enhancements ensure operation in nuclear electromagnetic pulse scenarios.The Gold formulation prevents fretting corrosion in high-vibration environments. Testing shows 10x better performance than standard finishes in sand/dust exposure tests.With 30.0µin (0.76µm) protection, the contacts maintain performance after 1,000 thermal shock cycles (-65 C to +150 C). This specification exceeds MIL-DTL-55302 requirements.
Product Attributes
- Product Status: Active
- Connector Type: High Density Array, Female
- Number of Positions: 300
- Pitch: 0.050" (1.27mm)
- Number of Rows: 10
- Mounting Type: Through Hole, Right Angle, Press-Fit
- Features: Board Guide
- Contact Finish: Gold
- Contact Finish Thickness: 30.0µin (0.76µm)
- Mated Stacking Heights: -
- Height Above Board: -
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