SEAFP-20-05.0-S-06

The SEAFP-20-05.0-S-06 by Samtec Inc. redefines Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) for IoT edge computing devices. This ultra-compact connector solution combines high-speed data transmission with power-over-Ethernet capabilities, making it perfect for smart city infrastructure and industrial IoT gateways.Featuring a High Density Array, Female design, this connector achieves 40Gbps data rates while maintaining PoE++ compatibility. The hybrid architecture supports simultaneous power delivery and high-speed differential signaling.With 120 contact arrangements available, designers can implement mixed-signal configurations. The optimized layout minimizes ground loop interference in sensor fusion applications.The micro 0.050" (1.27mm) spacing enables compact designs for space-constrained IoT nodes. This precision spacing has been validated for 10-year reliability in outdoor temperature cycling conditions.The 6 row configuration provides isolated power and signal paths. This arrangement prevents noise coupling between sensitive analog sensors and digital processors.Optimized for Through Hole installation, the connector features self-aligning guides for blind mating. The design withstands 500+ insertion cycles in field-serviceable equipment.The Gold technology prevents oxidation in high-humidity environments. Testing shows contact resistance stability within 2m after 1,000 humidity cycles.With 30.0µin (0.76µm) protection, the contacts maintain reliable connections despite micro-motion. This specification is critical for vibration-prone industrial environments.The 7mm options support modular IoT device architectures. The stackable design enables flexible expansion of edge computing capabilities.The low 0.197" (5.00mm) profile minimizes wind loading in outdoor installations. This design consideration is crucial for antenna-mounted IoT devices.