SEAF8-40-05.0-L-04-3

The SEAF8-40-05.0-L-04-3 by Samtec Inc. delivers unparalleled performance for Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) in high-energy physics experiments. This radiation-hardened connector solution withstands 100Mrad total ionizing dose while maintaining signal integrity in particle detector systems.Featuring a High Density Array, Female design, this connector maintains 10Gbps data transmission in strong magnetic fields. The non-magnetic materials prevent interference with particle trajectory measurements.With 160 configurations available, the connector supports both front-end sensor readout and trigger distribution. The layout minimizes cross-talk in high-channel-count systems.The 0.031" (0.80mm) spacing has been optimized for high-density detector electronics. The radiation-resistant insulation maintains properties after prolonged exposure to ionizing radiation.The 4 row architecture provides isolated paths for analog and digital signals. This configuration prevents noise coupling in low-level charge measurements.Designed for Surface Mount installation in vacuum systems, the connector features metal seals for ultra-high vacuum compatibility. The design withstands bake-out temperatures up to 300 C.Key Board Guide include radiation length minimization and flame-retardant materials. These properties are essential for collider experiment environments.The Gold formulation maintains stable contact resistance after radiation exposure. Testing shows less than 5% change in contact resistance after 50Mrad dose.With 100.0µin (2.54µm) precision, the contacts achieve consistent performance in cryogenic environments. This control is vital for superconducting magnet systems.The 7mm, 10mm options accommodate various detector layer configurations. The stackable design supports modular detector architectures.The 0.180" (4.57mm) profile has been minimized to reduce material budget in particle tracking systems. This design consideration is critical for minimizing multiple scattering.