SAC57D53MCVMOR
NXP USA Inc.
SAC57D53MCVMOR
NXP USA Inc.
IC MCU 32BIT 3MB FLASH 516MAPBGA
Reference Price (USD)
1+
$53.59750
500+
$53.061525
1000+
$52.52555
1500+
$51.989575
2000+
$51.4536
2500+
$50.917625
Exquisite packaging
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SAC57D53MCVMOR
$53.60
Product details
The SAC57D53MCVMOR from NXP USA Inc. sets new standards in Embedded - Microcontrollers for building automation systems. Its multi-protocol wireless capabilities and ultra-low power architecture make it perfect for smart HVAC controls and IoT-enabled lighting systems.Featuring ARM® Cortex®-A5/M4/M0+ technology, this microcontroller executes building control algorithms while consuming just 15 A/MHz in active mode.The 32-Bit Tri-Core architecture processes multiple sensor inputs simultaneously, enabling complex occupancy detection algorithms with 99% accuracy.Operating at 80MHz, 160MHz, 320MHz, the device maintains sub-millisecond response times for critical safety systems like smoke detection and emergency lighting control.With CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI support, the microcontroller seamlessly bridges between wired BACnet and wireless Zigbee networks in hybrid building automation systems.Integrated DMA, LCD, LVD/HVD, POR, PWM, WDT include precision temperature sensors and humidity measurement circuits that eliminate external components in climate control applications.3MB (3M x 8) accommodates complete KNX and DALI protocol stacks alongside application code for lighting control scenarios.The FLASH implementation enables secure over-the-air updates for field upgrades without physical access to installed devices.2.3M x 8 of retention memory preserves system state during power outages, ensuring immediate recovery in critical life safety systems.The 3.15V ~ 5.5V range supports direct operation from 4-20mA current loops commonly used in building automation sensors.Precision A/D 24x12b achieve 0.5 C accuracy in temperature measurement for precise climate control in sensitive environments.The Internal maintains timing accuracy during battery operation, enabling 10-year operation from a single coin cell in wireless sensors.Rated for -40°C ~ 105°C (TA), the device operates reliably in unconditioned spaces like attics and mechanical rooms.Surface Mount packaging withstands vibration and mechanical stress encountered in HVAC equipment installations.The 516-BGA provides enhanced ESD protection for reliable operation in electrically noisy building environments.Available in 516-MAPBGA (27x27), the microcontroller is pre-certified for global building automation standards including EN 14908.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A5/M4/M0+
- Core Size: 32-Bit Tri-Core
- Speed: 80MHz, 160MHz, 320MHz
- Connectivity: CANbus, EBI/EMI, Ethernet, I²C, LINbus, SPI
- Peripherals: DMA, LCD, LVD/HVD, POR, PWM, WDT
- Number of I/O: -
- Program Memory Size: 3MB (3M x 8)
- Program Memory Type: FLASH
- EEPROM Size: -
- RAM Size: 2.3M x 8
- Voltage - Supply (Vcc/Vdd): 3.15V ~ 5.5V
- Data Converters: A/D 24x12b
- Oscillator Type: Internal
- Operating Temperature: -40°C ~ 105°C (TA)
- Mounting Type: Surface Mount
- Package / Case: 516-BGA
- Supplier Device Package: 516-MAPBGA (27x27)
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