SA000-13007

Sunon Fans

General info

Part Number

SA000-13007

Manufacturer

Sunon Fans

Description:

PUSHPIN HEATSINK 43X43X10MM

Datasheet:

SA000-13007 PDF

Reference Price (USD)

$3.95000

500+

$3.9105

1000+

$3.871

1500+

$3.8315

2000+

$3.792

2500+

$3.7525

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

SA000-13007

$3.95

Product details

Sunon Fans's SA000-13007 delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.The Load Plate system provides uniform pressure distribution (75 5N) across the entire package area. The design prevents PCB warpage in multi-layer server motherboards.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.The 1.705" (43.30mm) dimension fits standard 19 rack server footprints while allowing for optimal airflow management. Computational fluid dynamics confirms no hot spot formation in rack-level simulations.With 1.713" (43.50mm) coverage, the solution accommodates dual-processor configurations without thermal interference. Thermal imaging shows less than 2 C variation between adjacent CPUs.Precision 0.394" (10.00mm) ensures compatibility with 40mm high-speed fans (15,000 RPM). The fin density is optimized for acoustic performance (<35dBA at 1m distance).Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.