S32G274AABK0VUCT
NXP USA Inc.
S32G274AABK0VUCT
NXP USA Inc.
4XA53 1GHZ, 3XM7 400MHZ
Reference Price (USD)
1+
$124.02000
500+
$122.7798
1000+
$121.5396
1500+
$120.2994
2000+
$119.0592
2500+
$117.819
Exquisite packaging
Discount
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S32G274AABK0VUCT
$124.02
Product details
The S32G274AABK0VUCT from NXP USA Inc. represents cutting-edge technology in the Embedded - Microprocessors segment, engineered for mission-critical embedded applications. This high-performance microprocessor combines robust architecture with advanced signal processing capabilities, delivering unparalleled computational density for next-generation IoT edge devices.Featuring an ARM® Cortex®-A53, ARM® Cortex®-M7 core, this microprocessor achieves optimal balance between power efficiency and processing throughput, making it ideal for real-time signal processing applications where deterministic latency is crucial.With 4 Core, 64-Bit/3 Core, 32-Bit configuration, the device enables parallel processing of complex algorithms while maintaining efficient power distribution across the silicon die.Operating at 400MHz, 1GHz, the processor delivers clock-synchronized performance that meets stringent timing requirements for industrial automation systems and robotic control applications.The integrated DDR3L SDRAM, LPDDR4 DRAM memory controllers provide low-latency access to high-bandwidth memory, essential for data-intensive applications like computer vision and machine learning inference.MII, RGMII, RMII, SGMII networking capabilities provide robust connectivity for industrial IoT deployments, supporting deterministic Ethernet protocols for real-time control systems.The USB OTG (1) interfaces offer flexible peripheral connectivity options, engineered to meet USB-IF compliance standards for reliable data transfer in harsh environments.Rated for -40°C ~ 105°C (TA) operation, this microprocessor maintains clock synchronization stability even under extreme thermal conditions encountered in automotive underhood applications.Advanced HSE-H ensure secure boot processes and runtime protection, meeting stringent cybersecurity requirements for networked industrial equipment.The 525-FBGA, FCBGA package configuration optimizes thermal dissipation while minimizing PCB footprint, crucial for space-constrained embedded designs.Available in 525-FCPBGA (19x19), the device offers multiple packaging options to accommodate different manufacturing processes and assembly requirements.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
- Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
- Speed: 400MHz, 1GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: MII, RGMII, RMII, SGMII
- SATA: -
- USB: USB OTG (1)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: HSE-H
- Package / Case: 525-FBGA, FCBGA
- Supplier Device Package: 525-FCPBGA (19x19)
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