S32G274AABK0CUCT
NXP USA Inc.
Product details
The S32G274AABK0CUCT by NXP USA Inc. establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM® Cortex®-A53, ARM® Cortex®-M7 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 4 Core, 64-Bit/3 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 400MHz, 1GHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The DDR3L SDRAM, LPDDR4 DRAM memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.MII, RGMII, RMII, SGMII connectivity enables distributed AI processing across edge nodes with precise time synchronization.The USB OTG (1) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Rated for -40°C ~ 85°C (TA) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented HSE-H include model encryption and secure model update mechanisms for protected edge AI deployments.The 525-FBGA, FCBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 525-FCPBGA (19x19), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A53, ARM® Cortex®-M7
- Number of Cores/Bus Width: 4 Core, 64-Bit/3 Core, 32-Bit
- Speed: 400MHz, 1GHz
- Co-Processors/DSP: -
- RAM Controllers: DDR3L SDRAM, LPDDR4 DRAM
- Graphics Acceleration: -
- Display & Interface Controllers: -
- Ethernet: MII, RGMII, RMII, SGMII
- SATA: -
- USB: USB OTG (1)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: HSE-H
- Package / Case: 525-FBGA, FCBGA
- Supplier Device Package: 525-FCPBGA (19x19)