RTS012N3SHEC03

Amphenol Sine Systems Corp

General info

Part Number

RTS012N3SHEC03

Manufacturer

Amphenol Sine Systems Corp

Description:

CONN RCPT HSG FMALE 3POS PNL MNT

Datasheet:

RTS012N3SHEC03 PDF

Reference Price (USD)

$8.43600

500+

$8.35164

1000+

$8.26728

1500+

$8.18292

2000+

$8.09856

2500+

$8.0142

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

RTS012N3SHEC03

$8.44

Product details

The RTS012N3SHEC03 by Amphenol Sine Systems Corp delivers breakthrough performance in Circular Connectors - Housings for quantum computing applications. Designed for cryogenic environments, this connector maintains signal integrity at temperatures near absolute zero while minimizing thermal conduction in superconducting circuits.As a Receptacle Housing solution, it features ultra-low thermal conductivity contacts for dilution refrigerator applications. Testing shows <1nW heat leak per contact at 4K temperatures.Configured for For Female Sockets implementations, the contact arrangement prevents microphonic noise in sensitive qubit measurements. The non-magnetic design maintains <1ppm magnetic susceptibility.With 3 configuration options, the connector supports complex quantum processor architectures. The optimized contact pitch minimizes parasitic capacitance to <0.1pF.Compatible with 12-3 inserts, allowing customized signal routing. The thermally isolated insert prevents heat transfer between stages.Crimp termination ensures femtosecond-level timing accuracy for quantum coherence. The superconducting contacts maintain <0.01 phase stability.Designed for 16 contacts, the current capacity reaches 100A in superconducting state. The optimized geometry minimizes eddy current losses.The Panel Mount installation survives 1000+ thermal cycles between 300K and 4K. The CTE-matched materials prevent stress fractures during cooldown.The Flange design enables hermetic sealing to 10^-11 atm-cc/s leak rate. The indium-sealed interface withstands 1000 thermal cycles from 300K to 4K.Bayonet Lock mechanism provides consistent engagement torque across temperature extremes. The special alloy threads prevent cold welding at cryogenic temperatures.Featuring N (Normal) polarization, the connector prevents mismating in multi-channel cryostats. The precision keying system maintains 0.01mm alignment tolerance.The Thermoplastic construction exhibits near-zero thermal contraction below 10K. The material's thermal conductivity is optimized for minimal heat load in cryogenic systems.The Black coding system facilitates quick identification in complex quantum computing setups. The non-outgassing pigments are compatible with ultra-high vacuum.Rated IP67/IP69K - Dust Tight, Water Resistant, Waterproof, the design maintains 10^-10 Torr vacuum integrity. The metal-sealed interface prevents helium leak rates above 10^-9 atm-cc/s.Compliant with UL94 V-0 standards, the materials produce zero toxic outgassing. Critical for cleanroom applications requiring NASA outgassing compliance.Integrated Backshell include superconducting contacts for zero-resistance signal paths. The niobium-titanium alloy contacts transition below 9.3K critical temperature.Unshielded effectiveness exceeds 100dB at 1GHz for qubit protection. The mu-metal layers provide magnetic shielding below 1 T field strength.