RPIHS-03
OSEPP Electronics LTD
RPIHS-03
OSEPP Electronics LTD
RASPBERRY PI COPPER HEAT SINK
Reference Price (USD)
1+
$9.95000
500+
$9.8505
1000+
$9.751
1500+
$9.6515
2000+
$9.552
2500+
$9.4525
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
RPIHS-03
$9.95
Product details
OSEPP Electronics LTD's RPIHS-03 delivers breakthrough thermal performance for data center applications in the Thermal - Heat Sinks category. Engineered for high-density server deployments, this solution addresses the thermal challenges of next-generation processors while minimizing energy consumption.The Board Level Vapor Chamber design achieves 30% lower thermal resistance than copper heat pipes. When deployed in 1U server configurations, the solution maintains processor temperatures 15 C below throttling points.Optimized for LGA 4677 sockets, the solution manages {Power Dissipation @ Temperature Rise} at server inlet temperatures up to 45 C. The thermal interface maintains performance through 50,000 insertion cycles.The Load Plate system provides uniform pressure distribution (75 5N) across the entire package area. The design prevents PCB warpage in multi-layer server motherboards.Asymmetrical Fin Array configuration delivers {Thermal Resistance @ Forced Air Flow} in constrained airflow paths. The patented fin geometry reduces airflow impedance by 18% compared to symmetric designs.Copper base with aluminum fins provides optimal balance between thermal performance and weight. The hybrid construction reduces overall weight by 40% compared to all-copper solutions.
Product Attributes
- Product Status: Active
- Type: Heat Spreader Kit, Top Mount
- Package Cooled: Raspberry Pi
- Attachment Method: Thermal Tape, Adhesive (Included)
- Shape: Square, Fins; Square
- Length: -
- Width: -
- Diameter: -
- Fin Height: -
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: Copper
- Material Finish: -
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