RM200-000-571-0000
AirBorn
RM200-000-571-0000
AirBorn
.075 HIGH DENSITY RECTANGULAR CO
Reference Price (USD)
1+
$10.95000
500+
$10.8405
1000+
$10.731
1500+
$10.6215
2000+
$10.512
2500+
$10.4025
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
RM200-000-571-0000
$10.95
Product details
The RM200-000-571-0000 from AirBorn revolutionizes Backplane Connectors - Contacts for IoT edge devices. Developed for low-power wireless sensor networks, this compact connector enables reliable data transmission while consuming 40% less energy than conventional solutions during active states.The Pin design features micro-power contact technology with activation currents as low as 10 A. This makes it ideal for energy harvesting applications where every microwatt counts.Utilizing Crimp methodology, the connection system achieves stable contact resistance below 50m at currents from 1mA to 1A. The broad dynamic range supports both sensor signals and power delivery.Compatible with 20-22 AWG ultra-fine wires, the termination system maintains pull-out strength above 8N while handling 30AWG conductors. The micro-crimp technology prevents strand breakage during installation.The Gold plating formulation minimizes triboelectric noise generation, critical for precision sensor applications. Tests show noise levels below 10nV/ Hz in the 0.1-10Hz bandwidth.
Product Attributes
- Product Status: Active
- Type: -
- Pin or Socket: Pin
- Contact Termination: Crimp
- Wire Gauge: 20-22 AWG
- Contact Finish: Gold
- Contact Finish Thickness: -
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