R9A07G075M27GBA#AC0
Renesas Electronics America Inc
R9A07G075M27GBA#AC0
Renesas Electronics America Inc
RZ/T2M MPU BGA225 NON-ETHER SEC
Reference Price (USD)
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$27.59000
500+
$27.3141
1000+
$27.0382
1500+
$26.7623
2000+
$26.4864
2500+
$26.2105
Exquisite packaging
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R9A07G075M27GBA#AC0
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Product details
The R9A07G075M27GBA#AC0 by Renesas Electronics America Inc establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM® Cortex®-R52 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 2 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 600MHz, 800MHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The Multimedia; NEON™ SIMD neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.No GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.10/100/1000Mbps (2) connectivity enables distributed AI processing across edge nodes with precise time synchronization.The USB 2.0 (1) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Designed with 1.8V, 3.3V tolerant I/Os, the device maintains signal integrity when interfacing with various industrial sensor networks.Rated for -40°C ~ 125°C (TJ) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented Boot Security, Crypto Accelerator, JTAG, TRNG include model encryption and secure model update mechanisms for protected edge AI deployments.The 225-LFBGA package incorporates advanced heat spreading technology for sustained AI workloads.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-R52
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 600MHz, 800MHz
- Co-Processors/DSP: Multimedia; NEON™ SIMD
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 1.8V, 3.3V
- Operating Temperature: -40°C ~ 125°C (TJ)
- Security Features: Boot Security, Crypto Accelerator, JTAG, TRNG
- Package / Case: 225-LFBGA
- Supplier Device Package: -
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