R9A06G033NGBG#AC0
Renesas Electronics America Inc
R9A06G033NGBG#AC0
Renesas Electronics America Inc
SOC ARM CORTEX RZ/N1S 324PIN
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Product details
The R9A06G033NGBG#AC0 by Renesas Electronics America Inc establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM® Cortex®-A7, ARM® Cortex®-M3 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 2 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 125MHz, 500MHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The DDR2, DDR3 memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.No GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.Supporting LCD outputs, the processor drives multiple high-resolution displays for AI visualization dashboards.10/100/1000Mbps connectivity enables distributed AI processing across edge nodes with precise time synchronization.The USB 2.0 (2) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Designed with 1.5V, 1.8V, 2.5V, 3.3V tolerant I/Os, the device maintains signal integrity when interfacing with various industrial sensor networks.Rated for -40°C ~ 85°C (TA) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256 include model encryption and secure model update mechanisms for protected edge AI deployments.The 324-LFBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 324-LFBGA (15x15), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Obsolete
- Core Processor: ARM® Cortex®-A7, ARM® Cortex®-M3
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 125MHz, 500MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: LCD
- Ethernet: 10/100/1000Mbps
- SATA: -
- USB: USB 2.0 (2)
- Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: AES, ARC4, DES, 3DES, MD5, SHA-1, SHA-224, SHA-256
- Package / Case: 324-LFBGA
- Supplier Device Package: 324-LFBGA (15x15)
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