R8A774C0HA01BG#G0
Renesas Electronics America Inc
R8A774C0HA01BG#G0
Renesas Electronics America Inc
RZ/G2E SOC HDMI-OFF 384K RAM PFB
Reference Price (USD)
1+
$33.45010
500+
$33.115599
1000+
$32.781098
1500+
$32.446597
2000+
$32.112096
2500+
$31.777595
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
R8A774C0HA01BG#G0
$33.45
Product details
The R8A774C0HA01BG#G0 by Renesas Electronics America Inc establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a ARM® Cortex®-A53 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 2 Core, 64-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 1.2GHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The Multimedia; NEON™ MPE neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The DDR3L memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.No GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.Supporting MIPI-CSI outputs, the processor drives multiple high-resolution displays for AI visualization dashboards.10/100Mbps (1), 100/1000Mbps (1) connectivity enables distributed AI processing across edge nodes with precise time synchronization.The USB 2.0 (1), USB 3.0 (1) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Rated for -40°C ~ 85°C (TA) operation, the processor reliably functions in uncontrolled edge computing environments.The 552-FBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 552-FBGA (21x21), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Active
- Core Processor: ARM® Cortex®-A53
- Number of Cores/Bus Width: 2 Core, 64-Bit
- Speed: 1.2GHz
- Co-Processors/DSP: Multimedia; NEON™ MPE
- RAM Controllers: DDR3L
- Graphics Acceleration: No
- Display & Interface Controllers: MIPI-CSI
- Ethernet: 10/100Mbps (1), 100/1000Mbps (1)
- SATA: -
- USB: USB 2.0 (1), USB 3.0 (1)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 85°C (TA)
- Security Features: -
- Package / Case: 552-FBGA
- Supplier Device Package: 552-FBGA (21x21)
You May Also Be Interested In
