QFS-078-04.25-H-D-A-GP-P

Samtec Inc.'s QFS-078-04.25-H-D-A-GP-P delivers breakthrough performance for Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board) in quantum computing applications. This cryogenic-rated connector maintains signal integrity at 4K temperatures while providing ultra-low thermal conductivity for superconducting circuits.The Receptacle, Center Strip Contacts configuration features special materials that minimize heat leak in dilution refrigerators. Unlike standard connectors, this design maintains stable impedance from room temperature to near absolute zero.Available in 156 configurations, the connector supports both qubit control lines and readout channels. The arrangement minimizes crosstalk between sensitive microwave signals.The 0.025" (0.64mm) spacing has been optimized for superconducting chip integration. The non-magnetic materials prevent flux trapping in quantum interference devices.The 2 row architecture provides isolated paths for DC bias and RF signals. This configuration has been validated for 50 impedance control at millikelvin temperatures.Designed for Surface Mount installation in cryogenic systems, the connector withstands repeated thermal cycling. The materials exhibit matched thermal contraction coefficients with common quantum computing substrates.Critical Board Guide, Ground Bus (Plane), Mating Guide, Pick and Place include ultra-high vacuum compatibility and non-outgassing materials. These properties are essential for maintaining clean environments in quantum processors.The Gold formulation maintains superconductivity at interface points. Special surface treatments prevent oxide formation in oxygen-free environments.With 30.0µin (0.76µm) precision, the contacts achieve consistent thermal and electrical performance. This control is vital for maintaining qubit coherence times.The 10mm, 11mm, 14mm options accommodate various quantum computing packaging approaches. The design minimizes vibrational coupling between stages.The 0.278" (7.06mm) profile has been optimized for integration with quantum chip carriers. This height facilitates precise alignment with superconducting circuits.