PXP6012/16S/CR

Bulgin

General info

Part Number

PXP6012/16S/CR

Manufacturer

Bulgin

Description:

CONN RCPT HSG FMALE 16POS PNL MT

Datasheet:

PXP6012/16S/CR PDF

Reference Price (USD)

$9.46800

500+

$9.37332

1000+

$9.27864

1500+

$9.18396

2000+

$9.08928

2500+

$8.9946

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

PXP6012/16S/CR

$9.47

Product details

The PXP6012/16S/CR by Bulgin delivers breakthrough performance in Circular Connectors - Housings for quantum computing applications. Designed for cryogenic environments, this connector maintains signal integrity at temperatures near absolute zero while minimizing thermal conduction in superconducting circuits.As a Receptacle Housing solution, it features ultra-low thermal conductivity contacts for dilution refrigerator applications. Testing shows <1nW heat leak per contact at 4K temperatures.Configured for For Female Sockets implementations, the contact arrangement prevents microphonic noise in sensitive qubit measurements. The non-magnetic design maintains <1ppm magnetic susceptibility.With 16 (Power) configuration options, the connector supports complex quantum processor architectures. The optimized contact pitch minimizes parasitic capacitance to <0.1pF.Crimp and Solder Cup termination ensures femtosecond-level timing accuracy for quantum coherence. The superconducting contacts maintain <0.01 phase stability.The Panel Mount installation survives 1000+ thermal cycles between 300K and 4K. The CTE-matched materials prevent stress fractures during cooldown.The Bulkhead - Rear Side Nut design enables hermetic sealing to 10^-11 atm-cc/s leak rate. The indium-sealed interface withstands 1000 thermal cycles from 300K to 4K.Push-Twist mechanism provides consistent engagement torque across temperature extremes. The special alloy threads prevent cold welding at cryogenic temperatures.Featuring Keyed polarization, the connector prevents mismating in multi-channel cryostats. The precision keying system maintains 0.01mm alignment tolerance.Using Plastic formulation, the connector exhibits negligible thermal emf (<0.1 V/K). The material's thermal conductivity is tailored for cryogenic heat sinking.The Polycarbonate/Polybutylene Terephthalate (PBT), Halogen Free construction exhibits near-zero thermal contraction below 10K. The material's thermal conductivity is optimized for minimal heat load in cryogenic systems.The Gray coding system facilitates quick identification in complex quantum computing setups. The non-outgassing pigments are compatible with ultra-high vacuum.Rated IP66/IP68/IP69K - Dust Tight, Water Resistant, Waterproof, the design maintains 10^-10 Torr vacuum integrity. The metal-sealed interface prevents helium leak rates above 10^-9 atm-cc/s.Compliant with UL94 V-0 standards, the materials produce zero toxic outgassing. Critical for cleanroom applications requiring NASA outgassing compliance.Unshielded effectiveness exceeds 100dB at 1GHz for qubit protection. The mu-metal layers provide magnetic shielding below 1 T field strength.