PSL-DCPL-IG-C

The PSL-DCPL-IG-C by Panduit Corp sets new benchmarks in the Modular Connectors - Accessories market segment through its hybrid polymer-metal composite construction. This advanced material science approach delivers the perfect balance between mechanical strength and signal fidelity for next-gen networking applications.Its RJ45 Plug Lock-In Device design incorporates redundant sealing paths that exceed IP69K requirements. The dual-material injection molding process ensures consistent performance across 2000+ thermal cycles from -40 C to +85 C.When integrated with RJ45 Plugs, this solution supports Power over Ethernet++ (PoE++) applications. The optimized thermal management design dissipates up to 30W without exceeding 65 C junction temperatures.Incorporating Additional Devices, Tool Included technologies, the product achieves Category 8.1 performance. Its unique differential pair arrangement minimizes skew to <50ps, enabling error-free transmission at 25Gbps speeds over 30m cable runs.The Gray surface treatment employs nano-ceramic coatings that reduce friction coefficient by 40%. This innovative approach significantly decreases wear particles generation while maintaining excellent chemical resistance to industrial solvents.