PPC8313ECVRAGDC
NXP USA Inc.
PPC8313ECVRAGDC
NXP USA Inc.
IC MPU MPC83XX 400MHZ 516BGA
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Product details
NXP USA Inc.'s PPC8313ECVRAGDC sets new benchmarks in the Embedded - Microprocessors market segment, optimized for compute-intensive embedded applications. This system-on-chip solution integrates advanced processing cores with sophisticated power management, delivering exceptional performance-per-watt characteristics for energy-conscious designs.The PowerPC e300c3 architecture provides deterministic execution of real-time tasks while maintaining low power consumption, making it particularly suitable for battery-powered edge computing devices.Architected with 1 Core, 32-Bit capability, the processor enables efficient task partitioning and memory bandwidth utilization in multi-threaded applications.With clock speeds up to 400MHz, the device meets the computational demands of advanced motor control algorithms and power conversion systems.The Security; SEC 2.2 acceleration units significantly enhance performance for matrix operations common in AI inference tasks.Support for DDR, DDR2 memory technologies allows designers to optimize system cost and performance for specific application requirements.The No graphics subsystem enables smooth rendering of complex graphical user interfaces without external GPU components.10/100/1000Mbps (2) connectivity options provide the necessary bandwidth for industrial communication protocols including EtherCAT and PROFINET.USB 2.0 + PHY (1) implementations adhere to the latest USB standards, ensuring backward compatibility while supporting high-speed data transfers.The 1.8V, 2.5V, 3.3V I/O banks offer design flexibility for interfacing with various peripheral devices in industrial control systems.Qualified for -40°C ~ 105°C (TA) operation, the processor reliably functions in outdoor telecommunications equipment and base station applications.Comprehensive Cryptography protect against both physical and network-based attacks, crucial for financial terminals and secure access systems.The 516-BBGA Exposed Pad package design incorporates advanced thermal management features for reliable operation in confined spaces.Offered in 516-TEPBGA (27x27), the device supports both conventional and advanced PCB assembly techniques.
Product Attributes
- Product Status: Obsolete
- Core Processor: PowerPC e300c3
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 400MHz
- Co-Processors/DSP: Security; SEC 2.2
- RAM Controllers: DDR, DDR2
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000Mbps (2)
- SATA: -
- USB: USB 2.0 + PHY (1)
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: Cryptography
- Package / Case: 516-BBGA Exposed Pad
- Supplier Device Package: 516-TEPBGA (27x27)
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