PL-05-3-254

Wakefield-Vette

General info

Part Number

PL-05-3-254

Manufacturer

Wakefield-Vette

Description:

THERM PAD 25.4MMX25.4MM GREEN

Datasheet:

PL-05-3-254 PDF

Reference Price (USD)

$2.74000

500+

$2.7126

1000+

$2.6852

1500+

$2.6578

2000+

$2.6304

2500+

$2.603

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

PL-05-3-254

$2.74

Product details

Wakefield-Vette's PL-05-3-254 delivers cutting-edge Thermal - Pads, Sheets solutions for next-generation 5G infrastructure. This high-performance thermal interface material addresses the unique thermal management challenges of RF power amplifiers and base station electronics.As a premium Gap Filler Pad, Sheet, this product combines exceptional thermal conductivity with excellent EMI shielding properties. This dual functionality simplifies thermal design in sensitive RF applications.Available in precision Square configurations, this material enables optimal thermal pathway design for complex RF modules. The geometrically optimized profiles ensure maximum heat transfer efficiency.Standard 25.40mm x 25.40mm sizes accommodate most common power amplifier packaging requirements. The size-optimized design allows for efficient thermal management in space-constrained base station equipment.With precise 0.0197" (0.500mm) control, this material provides predictable interface performance. The uniform cross-section ensures consistent thermal transfer characteristics across the entire contact area.The advanced Silicone Elastomer formulation offers exceptional resistance to high-temperature aging effects. This characteristic ensures long-term reliability in continuous operation scenarios.Featuring Tacky - Both Sides properties, this solution offers reliable component bonding without outgassing concerns. This characteristic is critical for maintaining clean environments in precision RF assemblies.The Green coding system facilitates quick material identification during assembly processes. This feature streamlines production workflows in high-mix manufacturing environments.Delivering 3.0W/m-K performance, this solution enables more efficient thermal designs for high-power RF applications. The material's consistent performance helps maintain signal integrity in sensitive circuits.