PH3-76.2-19.1-0.21-1A
t-Global Technology
PH3-76.2-19.1-0.21-1A
t-Global Technology
PH3 76.2X19.1X0.21MM
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Product details
The PH3-76.2-19.1-0.21-1A by t-Global Technology delivers military-grade reliability in the Thermal - Heat Sinks category for satellite communications. This space-qualified thermal solution combines exceptional performance with the ruggedness required for orbital and terrestrial extreme environments.The Dual-Phase Heat Pipe design maintains thermal resistance within 5% variance in zero-g conditions. Unlike conventional solutions, this configuration operates effectively at any orientation with respect to gravity.Engineered for GaN RF power amplifiers, the solution handles {Power Dissipation @ Temperature Rise} in vacuum conditions. The thermal interface maintains stable performance across 500+ thermal cycles from -150 C to +125 C.The Flexure Mount system compensates for CTE mismatches in composite satellite structures. The design maintains thermal contact pressure within 10% across the full operational temperature range.Spiral Fin configuration delivers {Thermal Resistance @ Natural} in omnidirectional radiation environments. The geometry maximizes surface area while minimizing molecular contamination risk.The 3.000" (76.20mm) dimension complies with CubeSat form factors while providing sufficient heat rejection capability. The design withstands launch vibration levels up to 20g RMS.With 0.750" (19.05mm) coverage, the solution accommodates multiple heat sources in constrained spacecraft volumes. Thermal analysis shows less than 5 C gradient across the entire structure.Optimized 0.008" (0.21mm) ensures effective radiation cooling in vacuum conditions. The black anodized surface maintains emissivity >0.95 after prolonged UV exposure.Aluminum 6061-T6 with Type III hard anodize meets MIL-A-8625 requirements. The material outgassing characteristics comply with NASA ASTM E595 standards.Black Anodized surface treatment provides optimal emissivity (0.92) for radiative cooling. The finish withstands atomic oxygen exposure in LEO environments.
Product Attributes
- Product Status: Obsolete
- Type: Heat Spreader
- Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method: Adhesive
- Shape: Rectangular
- Length: 3.000" (76.20mm)
- Width: 0.750" (19.05mm)
- Diameter: -
- Fin Height: 0.008" (0.21mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: -
- Material: Copper
- Material Finish: Polyester
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