P5CC081UA/S1AA821V
NXP USA Inc.
P5CC081UA/S1AA821V
NXP USA Inc.
P5CC081UA/S1AA821V
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Product details
NXP USA Inc.'s P5CC081UA/S1AA821V sets new benchmarks in Embedded - Microcontrollers performance, optimized for next-generation automotive electronics. Its radiation-hardened design and exceptional EMI immunity make it the preferred choice for safety-critical vehicle control systems.The Secure MX52 core architecture incorporates dual instruction pipelines that deliver 1.5 DMIPS/MHz, significantly enhancing computational throughput for autonomous driving algorithms.A 32-Bit Single-Core processing width enables single-cycle execution of complex DSP operations, reducing latency in active noise cancellation systems for premium automotive audio.When clocked at 62MHz, the microcontroller achieves 32-bit floating point operations in just 3 cycles, enabling real-time processing of LiDAR point clouds for ADAS applications.With ISO 7816, UART protocol support, the device forms the backbone of in-vehicle networks, providing deterministic communication between ECUs with <100ns synchronization accuracy.264KB (264K x 8) of fault-tolerant storage accommodates ASIL-D compliant software architectures with dual-core lockstep implementation for functional safety.The ROM implementation features ECC protection with single-bit correction capability, ensuring code integrity in high-vibration environments.With 80K x 8 of endurance-rated storage, the device can log diagnostic data through 100,000 write cycles - sufficient for the vehicle's entire service life.7.5K x 8 of parity-protected memory prevents data corruption from alpha particle strikes, meeting ISO 26262 requirements for safety-critical storage.An automotive-grade 1.62V ~ 5.6V range maintains operation during load dump events up to 40V, protecting against voltage transients common in 12V vehicle systems.Qualified for -25°C ~ 86°C, the device operates reliably in dashboard locations where ambient temperatures can exceed 85 C during summer conditions.The Surface Mount option provides superior solder joint reliability for PCB assemblies subjected to thermal cycling in underhood locations.Die packaging incorporates copper heat spreaders that reduce junction temperatures by 15 C compared to standard packages in confined spaces.Available in Wafer, the microcontroller supports AEC-Q100 Grade 1 qualification for deployment in safety-relevant automotive systems.
Product Attributes
- Product Status: Obsolete
- Core Processor: Secure MX52
- Core Size: 32-Bit Single-Core
- Speed: 62MHz
- Connectivity: ISO 7816, UART
- Peripherals: -
- Number of I/O: -
- Program Memory Size: 264KB (264K x 8)
- Program Memory Type: ROM
- EEPROM Size: 80K x 8
- RAM Size: 7.5K x 8
- Voltage - Supply (Vcc/Vdd): 1.62V ~ 5.6V
- Data Converters: -
- Oscillator Type: -
- Operating Temperature: -25°C ~ 86°C
- Mounting Type: Surface Mount
- Package / Case: Die
- Supplier Device Package: Wafer
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