P1025NSN5BFB
NXP USA Inc.
P1025NSN5BFB
NXP USA Inc.
IC MPU Q OR IQ 667MHZ 561TEBGA1
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Product details
The P1025NSN5BFB from NXP USA Inc. represents cutting-edge technology in the Embedded - Microprocessors segment, engineered for mission-critical embedded applications. This high-performance microprocessor combines robust architecture with advanced signal processing capabilities, delivering unparalleled computational density for next-generation IoT edge devices.Featuring an PowerPC e500v2 core, this microprocessor achieves optimal balance between power efficiency and processing throughput, making it ideal for real-time signal processing applications where deterministic latency is crucial.With 2 Core, 32-Bit configuration, the device enables parallel processing of complex algorithms while maintaining efficient power distribution across the silicon die.Operating at 667MHz, the processor delivers clock-synchronized performance that meets stringent timing requirements for industrial automation systems and robotic control applications.Enhanced by Communications; QUICC Engine co-processing units, the microprocessor delivers specialized performance for digital signal processing and cryptographic operations.The integrated DDR2, DDR3 memory controllers provide low-latency access to high-bandwidth memory, essential for data-intensive applications like computer vision and machine learning inference.No graphics support enables the processor to handle sophisticated human-machine interfaces without compromising system responsiveness or power budgets.10/100/1000Mbps (3) networking capabilities provide robust connectivity for industrial IoT deployments, supporting deterministic Ethernet protocols for real-time control systems.The USB 2.0 + PHY (2) interfaces offer flexible peripheral connectivity options, engineered to meet USB-IF compliance standards for reliable data transfer in harsh environments.Rated for 0°C ~ 125°C (TA) operation, this microprocessor maintains clock synchronization stability even under extreme thermal conditions encountered in automotive underhood applications.The 561-FBGA package configuration optimizes thermal dissipation while minimizing PCB footprint, crucial for space-constrained embedded designs.Available in 561-TEPBGA I (23x23), the device offers multiple packaging options to accommodate different manufacturing processes and assembly requirements.
Product Attributes
- Product Status: Obsolete
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 667MHz
- Co-Processors/DSP: Communications; QUICC Engine
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000Mbps (3)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 125°C (TA)
- Security Features: -
- Package / Case: 561-FBGA
- Supplier Device Package: 561-TEPBGA I (23x23)
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