P1020SSE2HFB
NXP USA Inc.
P1020SSE2HFB
NXP USA Inc.
IC MPU 800/400/667 HBGA689
Reference Price (USD)
1+
$0.00000
500+
$0
1000+
$0
1500+
$0
2000+
$0
2500+
$0
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
P1020SSE2HFB
$0.00
Product details
The P1020SSE2HFB by NXP USA Inc. establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a PowerPC e500v2 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 2 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 800MHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The Security; SEC 3.3 neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The DDR2, DDR3 memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.No GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.10/100/1000Mbps (3) connectivity enables distributed AI processing across edge nodes with precise time synchronization.The USB 2.0 + PHY (2) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Rated for 0°C ~ 125°C (TA) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented 3DES, AES, KASUMI, MD5, RNG, SHA, SNOW 3G include model encryption and secure model update mechanisms for protected edge AI deployments.The 689-BBGA Exposed Pad package incorporates advanced heat spreading technology for sustained AI workloads.Available in 689-TEPBGA II (31x31), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Obsolete
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Security; SEC 3.3
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000Mbps (3)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: 0°C ~ 125°C (TA)
- Security Features: 3DES, AES, KASUMI, MD5, RNG, SHA, SNOW 3G
- Package / Case: 689-BBGA Exposed Pad
- Supplier Device Package: 689-TEPBGA II (31x31)
You May Also Be Interested In