P1011NXN2HFB
NXP USA Inc.
P1011NXN2HFB
NXP USA Inc.
IC MPU Q OR IQ 800MHZ 689TEBGA
Reference Price (USD)
1+
$158.57037
500+
$156.9846663
1000+
$155.3989626
1500+
$153.8132589
2000+
$152.2275552
2500+
$150.6418515
Exquisite packaging
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P1011NXN2HFB
$158.57
Product details
The P1011NXN2HFB from NXP USA Inc. represents cutting-edge technology in the Embedded - Microprocessors segment, engineered for mission-critical embedded applications. This high-performance microprocessor combines robust architecture with advanced signal processing capabilities, delivering unparalleled computational density for next-generation IoT edge devices.Featuring an PowerPC e500v2 core, this microprocessor achieves optimal balance between power efficiency and processing throughput, making it ideal for real-time signal processing applications where deterministic latency is crucial.With 1 Core, 32-Bit configuration, the device enables parallel processing of complex algorithms while maintaining efficient power distribution across the silicon die.Operating at 800MHz, the processor delivers clock-synchronized performance that meets stringent timing requirements for industrial automation systems and robotic control applications.The integrated DDR2, DDR3 memory controllers provide low-latency access to high-bandwidth memory, essential for data-intensive applications like computer vision and machine learning inference.No graphics support enables the processor to handle sophisticated human-machine interfaces without compromising system responsiveness or power budgets.10/100/1000Mbps (3) networking capabilities provide robust connectivity for industrial IoT deployments, supporting deterministic Ethernet protocols for real-time control systems.The USB 2.0 + PHY (2) interfaces offer flexible peripheral connectivity options, engineered to meet USB-IF compliance standards for reliable data transfer in harsh environments.Rated for -40°C ~ 105°C (TA) operation, this microprocessor maintains clock synchronization stability even under extreme thermal conditions encountered in automotive underhood applications.The 689-BBGA Exposed Pad package configuration optimizes thermal dissipation while minimizing PCB footprint, crucial for space-constrained embedded designs.Available in 689-TEPBGA II (31x31), the device offers multiple packaging options to accommodate different manufacturing processes and assembly requirements.
Product Attributes
- Product Status: Obsolete
- Core Processor: PowerPC e500v2
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: -
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000Mbps (3)
- SATA: -
- USB: USB 2.0 + PHY (2)
- Voltage - I/O: -
- Operating Temperature: -40°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 689-BBGA Exposed Pad
- Supplier Device Package: 689-TEPBGA II (31x31)
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