OMAPL137BZKBT3

Texas Instruments

General info

Part Number

OMAPL137BZKBT3

Manufacturer

Texas Instruments

Description:

IC MPU OMAP-L1X 375MHZ 256BGA

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Product details

The OMAPL137BZKBT3 from Texas Instruments represents cutting-edge technology in the Embedded - Microprocessors segment, engineered for mission-critical embedded applications. This high-performance microprocessor combines robust architecture with advanced signal processing capabilities, delivering unparalleled computational density for next-generation IoT edge devices.Featuring an ARM926EJ-S core, this microprocessor achieves optimal balance between power efficiency and processing throughput, making it ideal for real-time signal processing applications where deterministic latency is crucial.With 1 Core, 32-Bit configuration, the device enables parallel processing of complex algorithms while maintaining efficient power distribution across the silicon die.Operating at 375MHz, the processor delivers clock-synchronized performance that meets stringent timing requirements for industrial automation systems and robotic control applications.Enhanced by Signal Processing; C674x, System Control; CP15 co-processing units, the microprocessor delivers specialized performance for digital signal processing and cryptographic operations.The integrated SDRAM memory controllers provide low-latency access to high-bandwidth memory, essential for data-intensive applications like computer vision and machine learning inference.No graphics support enables the processor to handle sophisticated human-machine interfaces without compromising system responsiveness or power budgets.Multiple display options including LCD ensure compatibility with diverse HMI configurations, from industrial panels to automotive infotainment systems.10/100Mbps (1) networking capabilities provide robust connectivity for industrial IoT deployments, supporting deterministic Ethernet protocols for real-time control systems.The USB 1.1 + PHY (1), USB 2.0 + PHY (1) interfaces offer flexible peripheral connectivity options, engineered to meet USB-IF compliance standards for reliable data transfer in harsh environments.Designed with 1.8V, 3.3V tolerant I/Os, the device demonstrates exceptional signal integrity across varying voltage domains in mixed-signal embedded systems.Rated for -40°C ~ 125°C (TJ) operation, this microprocessor maintains clock synchronization stability even under extreme thermal conditions encountered in automotive underhood applications.The 256-BGA package configuration optimizes thermal dissipation while minimizing PCB footprint, crucial for space-constrained embedded designs.Available in 256-BGA (17x17), the device offers multiple packaging options to accommodate different manufacturing processes and assembly requirements.