OMAPL137AZKB3
Texas Instruments
OMAPL137AZKB3
Texas Instruments
IC MPU OMAP-L1X 300MHZ 256BGA
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Product details
Texas Instruments's OMAPL137AZKB3 sets new benchmarks in the Embedded - Microprocessors market segment, optimized for compute-intensive embedded applications. This system-on-chip solution integrates advanced processing cores with sophisticated power management, delivering exceptional performance-per-watt characteristics for energy-conscious designs.The ARM926EJ-S architecture provides deterministic execution of real-time tasks while maintaining low power consumption, making it particularly suitable for battery-powered edge computing devices.Architected with 1 Core, 32-Bit capability, the processor enables efficient task partitioning and memory bandwidth utilization in multi-threaded applications.With clock speeds up to 300MHz, the device meets the computational demands of advanced motor control algorithms and power conversion systems.The Signal Processing; C674x, System Control; CP15 acceleration units significantly enhance performance for matrix operations common in AI inference tasks.Support for SDRAM memory technologies allows designers to optimize system cost and performance for specific application requirements.The No graphics subsystem enables smooth rendering of complex graphical user interfaces without external GPU components.Integrated LCD interfaces support direct connection to modern display technologies, reducing BOM costs in HMI applications.10/100Mbps (1) connectivity options provide the necessary bandwidth for industrial communication protocols including EtherCAT and PROFINET.USB 1.1 + PHY (1), USB 2.0 + PHY (1) implementations adhere to the latest USB standards, ensuring backward compatibility while supporting high-speed data transfers.The 1.8V, 3.3V I/O banks offer design flexibility for interfacing with various peripheral devices in industrial control systems.Qualified for 0°C ~ 90°C (TJ) operation, the processor reliably functions in outdoor telecommunications equipment and base station applications.The 256-BGA package design incorporates advanced thermal management features for reliable operation in confined spaces.Offered in 256-BGA (17x17), the device supports both conventional and advanced PCB assembly techniques.
Product Attributes
- Product Status: Obsolete
- Core Processor: ARM926EJ-S
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 300MHz
- Co-Processors/DSP: Signal Processing; C674x, System Control; CP15
- RAM Controllers: SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: LCD
- Ethernet: 10/100Mbps (1)
- SATA: -
- USB: USB 1.1 + PHY (1), USB 2.0 + PHY (1)
- Voltage - I/O: 1.8V, 3.3V
- Operating Temperature: 0°C ~ 90°C (TJ)
- Security Features: -
- Package / Case: 256-BGA
- Supplier Device Package: 256-BGA (17x17)
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