MYC-C7Z010-4E1D-667-I
MYIR Tech Limited
Product details
Engineered for next-generation automotive electronics, the MYC-C7Z010-4E1D-667-I by MYIR Tech Limited redefines performance in the Embedded - Microcontroller, Microprocessor, FPGA Modules category. Its combination of functional safety features and high-speed processing makes it ideal for ADAS and autonomous vehicle perception systems.The MCU, FPGA architecture provides automotive-grade reliability with its dual-core lockstep configuration. This fail-operational design exceeds ISO 26262 ASIL-D requirements for safety-critical vehicle systems.The ARM® Cortex®-A9 delivers automotive-qualified performance with its temperature-compensated clock generation. Its superscalar architecture efficiently processes multiple sensor fusion algorithms simultaneously for comprehensive environment modeling.With the Zynq-7000 (Z-7010) handling dedicated neural network acceleration, the module achieves unprecedented object detection speeds. This hardware acceleration is crucial for meeting the low-latency demands of autonomous emergency braking systems.Operating at 667MHz, the processor meets the real-time requirements of vehicle bus networks. The clock distribution network features automotive-grade jitter attenuation for reliable CAN FD and Automotive Ethernet communication.The 32MB flash memory supports over-the-air update capabilities with robust rollback protection. This secure storage solution is essential for complying with automotive cybersecurity standards like WP.29.1GB of error-correcting RAM ensures fault-tolerant operation of safety monitors. The memory subsystem's parity checking provides additional protection against single-event upsets in radiation-prone environments.The automotive-grade Board-to-Board (BTB) Socket - 280 interface meets USCAR vibration specifications. Its sealed design prevents moisture ingress in under-hood applications while maintaining signal integrity at high speeds.With dimensions of 2.95" x 2.17" (75mm x 55mm), the module fits within stringent automotive form factor requirements. The package's thermal design maintains performance during extended high-temperature operation in engine compartments.Qualified for -40°C ~ 85°C, the solution withstands the thermal extremes of electric vehicle power electronics. Extensive reliability testing ensures operation throughout the vehicle's lifespan.
Product Attributes
- Product Status: Active
- Module/Board Type: MCU, FPGA
- Core Processor: ARM® Cortex®-A9
- Co-Processor: Zynq-7000 (Z-7010)
- Speed: 667MHz
- Flash Size: 32MB
- RAM Size: 1GB
- Connector Type: Board-to-Board (BTB) Socket - 280
- Size / Dimension: 2.95" x 2.17" (75mm x 55mm)
- Operating Temperature: -40°C ~ 85°C