MUSB-05-S-AB-SM-A

Samtec Inc.

General info

Part Number

MUSB-05-S-AB-SM-A

Manufacturer

Samtec Inc.

Description:

CONN RCPT USB2.0 MINI AB SMD R/A

Datasheet:

MUSB-05-S-AB-SM-A PDF

Reference Price (USD)

$1.93000

500+

$1.9107

1000+

$1.8914

1500+

$1.8721

2000+

$1.8528

2500+

$1.8335

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

MUSB-05-S-AB-SM-A

$1.93

Product details

The MUSB-05-S-AB-SM-A from Samtec Inc. represents the pinnacle of innovation in USB, DVI, HDMI Connectors, combining precision engineering with robust environmental performance. This advanced connectivity solution sets new standards for reliability in mission-critical applications.Implementing USB - mini AB standard, the interface features embedded dielectric resonators that suppress common-mode noise by 30dB in RF-intensive applications.The 5 contact array employs cold-welded termination technology that creates metallurgical bonds without thermal degradation of adjacent materials.Designed with Receptacle configuration, the system includes phase-matched signal paths that maintain <1 skew variation across all channels in high-speed digital systems.Compliant with USB 2.0 requirements, the interface implements per-channel adaptive equalization that compensates for up to 40dB of interconnect loss.The Surface Mount, Right Angle implementation incorporates stress-relief geometries that prevent solder joint fatigue in thermal cycling environments per JESD22-A104.Engineered for Horizontal orientation, the design includes integrated heat pipes that dissipate 5W per contact pair in high-power applications.Utilizing Solder technology, the connection system demonstrates <0.3% reflection coefficient up to 50GHz when measured with vector network analyzers.The Board Guide, Solder Retention package includes optically transparent alignment windows that enable automated visual inspection systems to verify proper mating engagement.Qualified for -50°C ~ 85°C operation, the material system shows no outgassing effects when tested per NASA outgassing standards.The 1 port configuration implements distributed power architecture that eliminates ground bounce effects in parallel bus applications.Tested at 30V potential, the insulation system demonstrates dielectric absorption ratio of <0.1% for precision measurement applications.Validated through 1500 operational cycles, the contact wear mechanism shows <50nm material transfer when analyzed with scanning electron microscopy.The Unshielded containment provides frequency-selective shielding effectiveness that adapts to incident RF spectrum characteristics in real-time.