MS27513E8F98B

Conesys

General info

Part Number

MS27513E8F98B

Manufacturer

Conesys

Description:

CONN RCPT FMALE 3POS CRIMP

Reference Price (USD)

$47.22000

500+

$46.7478

1000+

$46.2756

1500+

$45.8034

2000+

$45.3312

2500+

$44.859

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

MS27513E8F98B

$47.22

Product details

The MS27513E8F98B by Conesys delivers breakthrough performance in Circular Connectors - Housings for quantum computing applications. Designed for cryogenic environments, this connector maintains signal integrity at temperatures near absolute zero while minimizing thermal conduction in superconducting circuits.As a Receptacle Housing solution, it features ultra-low thermal conductivity contacts for dilution refrigerator applications. Testing shows <1nW heat leak per contact at 4K temperatures.Configured for For Female Sockets implementations, the contact arrangement prevents microphonic noise in sensitive qubit measurements. The non-magnetic design maintains <1ppm magnetic susceptibility.With 3 configuration options, the connector supports complex quantum processor architectures. The optimized contact pitch minimizes parasitic capacitance to <0.1pF.Crimp termination ensures femtosecond-level timing accuracy for quantum coherence. The superconducting contacts maintain <0.01 phase stability.The Panel Mount installation survives 1000+ thermal cycles between 300K and 4K. The CTE-matched materials prevent stress fractures during cooldown.The Flange design enables hermetic sealing to 10^-11 atm-cc/s leak rate. The indium-sealed interface withstands 1000 thermal cycles from 300K to 4K.Bayonet Lock mechanism provides consistent engagement torque across temperature extremes. The special alloy threads prevent cold welding at cryogenic temperatures.Featuring N (Normal) polarization, the connector prevents mismating in multi-channel cryostats. The precision keying system maintains 0.01mm alignment tolerance.Using Metal formulation, the connector exhibits negligible thermal emf (<0.1 V/K). The material's thermal conductivity is tailored for cryogenic heat sinking.The Aluminum construction exhibits near-zero thermal contraction below 10K. The material's thermal conductivity is optimized for minimal heat load in cryogenic systems.Nickel surface treatment maintains <0.1 contact resistance at 4K. The coating withstands 1000+ vacuum cycles without degradation.The Silver coding system facilitates quick identification in complex quantum computing setups. The non-outgassing pigments are compatible with ultra-high vacuum.Shielded effectiveness exceeds 100dB at 1GHz for qubit protection. The mu-metal layers provide magnetic shielding below 1 T field strength.