MS27484T22F35BD

Conesys

General info

Part Number

MS27484T22F35BD

Manufacturer

Conesys

Description:

CONN PLUG FMALE 100POS CRIMP

Reference Price (USD)

$99.73000

500+

$98.7327

1000+

$97.7354

1500+

$96.7381

2000+

$95.7408

2500+

$94.7435

Exquisite packaging

Discount

TT / Paypal / Credit Card / Western Union / Money Gram

MS27484T22F35BD

$99.73

Product details

The MS27484T22F35BD by Conesys delivers breakthrough performance in Circular Connectors - Housings for quantum computing applications. Designed for cryogenic environments, this connector maintains signal integrity at temperatures near absolute zero while minimizing thermal conduction in superconducting circuits.As a Plug Housing solution, it features ultra-low thermal conductivity contacts for dilution refrigerator applications. Testing shows <1nW heat leak per contact at 4K temperatures.Configured for For Female Sockets implementations, the contact arrangement prevents microphonic noise in sensitive qubit measurements. The non-magnetic design maintains <1ppm magnetic susceptibility.With 100 configuration options, the connector supports complex quantum processor architectures. The optimized contact pitch minimizes parasitic capacitance to <0.1pF.Compatible with 22-35 inserts, allowing customized signal routing. The thermally isolated insert prevents heat transfer between stages.Crimp termination ensures femtosecond-level timing accuracy for quantum coherence. The superconducting contacts maintain <0.01 phase stability.The Free Hanging (In-Line) installation survives 1000+ thermal cycles between 300K and 4K. The CTE-matched materials prevent stress fractures during cooldown.Bayonet Lock mechanism provides consistent engagement torque across temperature extremes. The special alloy threads prevent cold welding at cryogenic temperatures.Featuring D polarization, the connector prevents mismating in multi-channel cryostats. The precision keying system maintains 0.01mm alignment tolerance.Using Metal formulation, the connector exhibits negligible thermal emf (<0.1 V/K). The material's thermal conductivity is tailored for cryogenic heat sinking.The Aluminum construction exhibits near-zero thermal contraction below 10K. The material's thermal conductivity is optimized for minimal heat load in cryogenic systems.Nickel surface treatment maintains <0.1 contact resistance at 4K. The coating withstands 1000+ vacuum cycles without degradation.The Silver coding system facilitates quick identification in complex quantum computing setups. The non-outgassing pigments are compatible with ultra-high vacuum.Shielded effectiveness exceeds 100dB at 1GHz for qubit protection. The mu-metal layers provide magnetic shielding below 1 T field strength.