MPFS460T-FCG1152IPP
Microchip Technology
MPFS460T-FCG1152IPP
Microchip Technology
MPFS460T-FCG1152IPP
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Product details
The MPFS460T-FCG1152IPP by Microchip Technology is a breakthrough in Embedded - System On Chip (SoC), designed for ultra-low-power IoT edge devices. This SoC combines energy-efficient processing with advanced sleep modes, making it perfect for battery-powered applications where power consumption and signal integrity are crucial for extended operational life.Utilizing a MPU, FPGA architecture, the device achieves unprecedented power efficiency while maintaining reliable data throughput for sensor fusion applications.The RISC-V core delivers optimal performance-per-watt ratios, enabling complex edge AI computations within tight energy budgets.128kB of flash memory provides sufficient storage for machine learning models and over-the-air update capabilities in remote deployments.With 3.95MB of ultra-low-leakage RAM, the processor maintains data retention during deep sleep modes critical for energy harvesting systems.Integrated DMA, PCI, PWM include precision ADCs and wireless interfaces that eliminate the need for external components in compact designs.The CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG options support both short-range and LPWAN protocols, ensuring seamless integration into diverse IoT ecosystems.FPGA - 461K Logic Modules feature hardware-accelerated encryption engines that secure device-to-cloud communications without compromising battery life.Rated for -40°C ~ 100°C, the component maintains reliable operation in extreme environmental monitoring applications.The 1152-BBGA, FCBGA package enables ultra-compact designs while providing robust thermal characteristics.Available in 1152-FCBGA (35x35), the device supports automated assembly processes for high-volume IoT product manufacturing.
Product Attributes
- Product Status: Active
- Architecture: MPU, FPGA
- Core Processor: RISC-V
- Flash Size: 128kB
- RAM Size: 3.95MB
- Peripherals: DMA, PCI, PWM
- Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
- Speed: -
- Primary Attributes: FPGA - 461K Logic Modules
- Operating Temperature: -40°C ~ 100°C
- Package / Case: 1152-BBGA, FCBGA
- Supplier Device Package: 1152-FCBGA (35x35)
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