MPFS250TS-FCVG784I
Microchip Technology
MPFS250TS-FCVG784I
Microchip Technology
MPFS250TS-FCVG784I
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Product details
Engineered for next-generation automotive electronics, Microchip Technology's MPFS250TS-FCVG784I redefines Embedded - System On Chip (SoC) performance in vehicular applications. This advanced SoC combines automotive-grade reliability with sophisticated power management, making MPFS250TS-FCVG784I the ideal choice for ADAS systems where signal integrity and functional safety are paramount.The dual-core MPU, FPGA architecture provides redundant processing paths that meet ASIL-D requirements for autonomous driving subsystems.Featuring the RISC-V, the device delivers the computational density needed for real-time sensor fusion while meeting stringent automotive power budgets.128kB of automotive-qualified flash memory ensures secure storage for machine learning models and over-the-air update packages.With 2.2MB of error-protected RAM, the processor maintains data coherence during sudden power fluctuations common in automotive environments.Automotive-specific DMA, PCI, PWM include CAN-FD controllers and automotive Ethernet MACs, reducing the need for external interface chips.The comprehensive CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG suite supports in-vehicle network topologies while providing robust EMI performance essential for automotive applications.FPGA - 254K Logic Modules include hardware security modules that provide cryptographic acceleration for secure vehicle-to-cloud communications.Qualified for -40°C ~ 100°C, the component maintains precise timing references across the full automotive temperature range.The 784-BFBGA, FCBGA package features automotive-grade materials that withstand thermal shock and mechanical vibration.Available in 784-FCBGA (23x23), the device meets AEC-Q100 Grade 1 requirements for automotive electronics.
Product Attributes
- Product Status: Active
- Architecture: MPU, FPGA
- Core Processor: RISC-V
- Flash Size: 128kB
- RAM Size: 2.2MB
- Peripherals: DMA, PCI, PWM
- Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
- Speed: -
- Primary Attributes: FPGA - 254K Logic Modules
- Operating Temperature: -40°C ~ 100°C
- Package / Case: 784-BFBGA, FCBGA
- Supplier Device Package: 784-FCBGA (23x23)
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