MPFS250T-FCSG536T2
Microchip Technology
MPFS250T-FCSG536T2
Microchip Technology
MPFS250T-FCSG536T2
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Product details
Microchip Technology's MPFS250T-FCSG536T2 redefines Embedded - System On Chip (SoC) technology for professional audio equipment. Optimized for studio-grade signal processing, this SoC combines ultra-low distortion analog paths with powerful DSP capabilities, making MPFS250T-FCSG536T2 the preferred choice for digital mixers and audio interfaces where pristine signal quality is essential.The MPU, FPGA architecture features parallel DSP cores with dedicated audio processing accelerators for real-time effects processing.The RISC-V core delivers the computational density needed for multi-channel audio processing with sample-accurate synchronization.128KB of low-latency flash memory stores extensive effect presets and configuration profiles.With 2.2MB of high-fidelity RAM, the processor maintains zero-wait-state performance for audio buffer processing.Audio-specific DMA, PCI, PWM include high-dynamic-range ADCs/DACs and professional digital audio interfaces.The CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG suite supports all major audio networking protocols while maintaining strict jitter performance.FPGA - 254K Logic Modules include hardware-accelerated floating-point processing for studio-quality effects algorithms.Designed for -40°C ~ 125°C (TJ) operation, the component maintains stable performance in demanding studio environments.The 536-LFBGA package provides optimal EMI shielding for noise-sensitive audio applications.Available in 536-BGA (16x16), the device meets professional audio equipment reliability standards.
Product Attributes
- Product Status: Active
- Architecture: MPU, FPGA
- Core Processor: RISC-V
- Flash Size: 128KB
- RAM Size: 2.2MB
- Peripherals: DMA, PCI, PWM
- Connectivity: CANbus, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
- Speed: -
- Primary Attributes: FPGA - 254K Logic Modules
- Operating Temperature: -40°C ~ 125°C (TJ)
- Package / Case: 536-LFBGA
- Supplier Device Package: 536-BGA (16x16)
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