MPFS095TLS-FCSG536I
Microchip Technology
MPFS095TLS-FCSG536I
Microchip Technology
MPFS095TLS-FCSG536I
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Product details
Microchip Technology's MPFS095TLS-FCSG536I revolutionizes Embedded - System On Chip (SoC) technology for aerospace and defense applications. Optimized for extreme environments, this radiation-hardened SoC combines fault-tolerant design with military-grade reliability, making MPFS095TLS-FCSG536I the preferred choice for satellite systems where component longevity and single-event upset immunity are critical.The triple-redundant MPU, FPGA architecture provides SEU mitigation through continuous voting logic, ensuring uninterrupted operation in high-radiation orbits.The RISC-V core delivers space-qualified processing power with built-in error detection and correction mechanisms for mission-critical computations.128kB of radiation-tolerant flash memory provides secure storage for flight software with single-bit error correction capabilities.With 857.6kB of scrubbed RAM, the processor maintains data integrity even during solar flare events and other space radiation phenomena.Space-grade DMA, PCI, PWM include MIL-STD-1553 interfaces and spacewire controllers essential for spacecraft avionics systems.The CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG suite supports both traditional aerospace databuses and modern high-speed interconnects required for next-generation satellite payloads.FPGA - 93K Logic Modules include latch-up immune circuitry and total dose radiation hardening to 100krad(Si) for long-duration missions.Qualified for -40°C ~ 100°C, the component maintains stable operation from cryogenic space environments to sun-facing satellite surfaces.The 536-BGA package features hermetic sealing and gold-plated contacts for reliability in vacuum conditions.Available in 536-LFBGA, the device meets MIL-PRF-38535 Class K requirements for space applications.
Product Attributes
- Product Status: Active
- Architecture: MPU, FPGA
- Core Processor: RISC-V
- Flash Size: 128kB
- RAM Size: 857.6kB
- Peripherals: DMA, PCI, PWM
- Connectivity: CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG
- Speed: -
- Primary Attributes: FPGA - 93K Logic Modules
- Operating Temperature: -40°C ~ 100°C
- Package / Case: 536-BGA
- Supplier Device Package: 536-LFBGA
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