MPF200TLS-FCSG325I

The MPF200TLS-FCSG325I by Microchip Technology establishes new benchmarks in Embedded - FPGAs (Field Programmable Gate Array), specifically designed for AI acceleration and neural network processing. This FPGA features an innovative architecture that combines high-speed data throughput with energy-efficient computation, making it perfect for edge computing devices and smart city infrastructure. Its adaptive clock distribution network ensures precise timing alignment across multiple processing cores.Boasting 192000 programmable logic elements, this device enables massive parallel processing required for deep learning algorithms. When operating in neural network mode, the logic fabric demonstrates superior performance per watt compared to traditional processing architectures.Equipped with 13619200 bits of high-bandwidth memory, the FPGA supports real-time data streaming for convolutional neural networks. The memory subsystem incorporates error detection and correction mechanisms to ensure data integrity in mission-critical AI applications.Featuring 170 configurable I/O channels, the device offers unparalleled flexibility for sensor fusion applications. Each I/O bank includes adaptive impedance matching to maintain signal quality across varying load conditions.Operating within 0.97V ~ 1.08V range, this FPGA implements dynamic voltage and frequency scaling to optimize power consumption. The power delivery network features low-ESR decoupling capacitors for clean power distribution.Designed for Surface Mount installation, the package ensures reliable operation in thermally challenging environments. The advanced thermal interface material minimizes junction-to-case thermal resistance.Rated for -40°C ~ 100°C (TJ) operation, the device maintains stable performance in outdoor deployment scenarios. The temperature-compensated bias circuits prevent parameter drift in precision measurement applications.The 325-LFBGA, FC package incorporates advanced EMI shielding techniques for RF-sensitive applications. The package geometry has been optimized for efficient heat dissipation in confined spaces.Available in 325-FCBGA (11x14.5) configuration, the device supports high-volume automated assembly processes. The packaging includes moisture sensitivity indicators for quality control.