MPC875ZT66
Freescale Semiconductor
MPC875ZT66
Freescale Semiconductor
POWERQUICC RISC MICROPROCESSOR,
Reference Price (USD)
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$24.58000
500+
$24.3342
1000+
$24.0884
1500+
$23.8426
2000+
$23.5968
2500+
$23.351
Exquisite packaging
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MPC875ZT66
$24.58
Product details
The MPC875ZT66 by Freescale Semiconductor establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a MPC8xx neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 1 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 66MHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The Communications; CPM, Security; SEC neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The DRAM memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.No GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.10Mbps (1), 10/100Mbps (2) connectivity enables distributed AI processing across edge nodes with precise time synchronization.The USB 2.0 (1) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Designed with 3.3V tolerant I/Os, the device maintains signal integrity when interfacing with various industrial sensor networks.Rated for 0°C ~ 95°C (TA) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented Cryptography include model encryption and secure model update mechanisms for protected edge AI deployments.The 256-BBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 256-PBGA (23x23), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Active
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 66MHz
- Co-Processors/DSP: Communications; CPM, Security; SEC
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10Mbps (1), 10/100Mbps (2)
- SATA: -
- USB: USB 2.0 (1)
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 95°C (TA)
- Security Features: Cryptography
- Package / Case: 256-BBGA
- Supplier Device Package: 256-PBGA (23x23)
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