MPC8572PXARLD
NXP USA Inc.
MPC8572PXARLD
NXP USA Inc.
IC MPU MPC85XX 1.067GHZ 1023BGA
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Product details
The MPC8572PXARLD from NXP USA Inc. represents cutting-edge technology in the Embedded - Microprocessors segment, engineered for mission-critical embedded applications. This high-performance microprocessor combines robust architecture with advanced signal processing capabilities, delivering unparalleled computational density for next-generation IoT edge devices.Featuring an PowerPC e500 core, this microprocessor achieves optimal balance between power efficiency and processing throughput, making it ideal for real-time signal processing applications where deterministic latency is crucial.With 2 Core, 32-Bit configuration, the device enables parallel processing of complex algorithms while maintaining efficient power distribution across the silicon die.Operating at 1.067GHz, the processor delivers clock-synchronized performance that meets stringent timing requirements for industrial automation systems and robotic control applications.Enhanced by Signal Processing; SPE co-processing units, the microprocessor delivers specialized performance for digital signal processing and cryptographic operations.The integrated DDR2, DDR3 memory controllers provide low-latency access to high-bandwidth memory, essential for data-intensive applications like computer vision and machine learning inference.No graphics support enables the processor to handle sophisticated human-machine interfaces without compromising system responsiveness or power budgets.10/100/1000Mbps (4) networking capabilities provide robust connectivity for industrial IoT deployments, supporting deterministic Ethernet protocols for real-time control systems.Designed with 1.5V, 1.8V, 2.5V, 3.3V tolerant I/Os, the device demonstrates exceptional signal integrity across varying voltage domains in mixed-signal embedded systems.Rated for 0°C ~ 105°C (TA) operation, this microprocessor maintains clock synchronization stability even under extreme thermal conditions encountered in automotive underhood applications.The 1023-BFBGA, FCBGA package configuration optimizes thermal dissipation while minimizing PCB footprint, crucial for space-constrained embedded designs.Available in 1023-FCBGA (33x33), the device offers multiple packaging options to accommodate different manufacturing processes and assembly requirements.
Product Attributes
- Product Status: Obsolete
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 2 Core, 32-Bit
- Speed: 1.067GHz
- Co-Processors/DSP: Signal Processing; SPE
- RAM Controllers: DDR2, DDR3
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.5V, 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 1023-BFBGA, FCBGA
- Supplier Device Package: 1023-FCBGA (33x33)
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