MPC8543EVTANGD557
Freescale Semiconductor
MPC8543EVTANGD557
Freescale Semiconductor
POWERQUICC III INTEGRATED PROCES
Reference Price (USD)
1+
$0.00000
500+
$0
1000+
$0
1500+
$0
2000+
$0
2500+
$0
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
MPC8543EVTANGD557
$0.00
Product details
The MPC8543EVTANGD557 by Freescale Semiconductor establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a PowerPC e500 neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 1 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 800MHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The Signal Processing; SPE, Security; SEC neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The DDR, DDR2, SDRAM memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.No GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.10/100/1000Mbps (4) connectivity enables distributed AI processing across edge nodes with precise time synchronization.Designed with 1.8V, 2.5V, 3.3V tolerant I/Os, the device maintains signal integrity when interfacing with various industrial sensor networks.Rated for 0°C ~ 105°C (TA) operation, the processor reliably functions in uncontrolled edge computing environments.AI-oriented AES, Cryptography, Kasumi, Random Number Generator include model encryption and secure model update mechanisms for protected edge AI deployments.The 783-BBGA, FCBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 783-FCPBGA (29x29), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Active
- Core Processor: PowerPC e500
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 800MHz
- Co-Processors/DSP: Signal Processing; SPE, Security; SEC
- RAM Controllers: DDR, DDR2, SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10/100/1000Mbps (4)
- SATA: -
- USB: -
- Voltage - I/O: 1.8V, 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: AES, Cryptography, Kasumi, Random Number Generator
- Package / Case: 783-BBGA, FCBGA
- Supplier Device Package: 783-FCPBGA (29x29)
You May Also Be Interested In