MPC850DSLCZQ50BU
NXP USA Inc.
MPC850DSLCZQ50BU
NXP USA Inc.
IC MPU MPC8XX 50MHZ 256BGA
Reference Price (USD)
1+
$38.37000
500+
$37.9863
1000+
$37.6026
1500+
$37.2189
2000+
$36.8352
2500+
$36.4515
Exquisite packaging
Discount
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MPC850DSLCZQ50BU
$38.37
Product details
NXP USA Inc.'s MPC850DSLCZQ50BU sets new benchmarks in the Embedded - Microprocessors market segment, optimized for compute-intensive embedded applications. This system-on-chip solution integrates advanced processing cores with sophisticated power management, delivering exceptional performance-per-watt characteristics for energy-conscious designs.The MPC8xx architecture provides deterministic execution of real-time tasks while maintaining low power consumption, making it particularly suitable for battery-powered edge computing devices.Architected with 1 Core, 32-Bit capability, the processor enables efficient task partitioning and memory bandwidth utilization in multi-threaded applications.With clock speeds up to 50MHz, the device meets the computational demands of advanced motor control algorithms and power conversion systems.The Communications; CPM acceleration units significantly enhance performance for matrix operations common in AI inference tasks.Support for DRAM memory technologies allows designers to optimize system cost and performance for specific application requirements.The No graphics subsystem enables smooth rendering of complex graphical user interfaces without external GPU components.10Mbps (1) connectivity options provide the necessary bandwidth for industrial communication protocols including EtherCAT and PROFINET.USB 1.x (1) implementations adhere to the latest USB standards, ensuring backward compatibility while supporting high-speed data transfers.The 3.3V I/O banks offer design flexibility for interfacing with various peripheral devices in industrial control systems.Qualified for -40°C ~ 95°C (TA) operation, the processor reliably functions in outdoor telecommunications equipment and base station applications.The 256-BBGA package design incorporates advanced thermal management features for reliable operation in confined spaces.Offered in 256-PBGA (23x23), the device supports both conventional and advanced PCB assembly techniques.
Product Attributes
- Product Status: Obsolete
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 50MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 256-BBGA
- Supplier Device Package: 256-PBGA (23x23)
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