MPC850CZQ50BU
NXP USA Inc.
MPC850CZQ50BU
NXP USA Inc.
IC MPU MPC8XX 50MHZ 256BGA
Reference Price (USD)
1+
$41.67000
500+
$41.2533
1000+
$40.8366
1500+
$40.4199
2000+
$40.0032
2500+
$39.5865
Exquisite packaging
Discount
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MPC850CZQ50BU
$41.67
Product details
The MPC850CZQ50BU by NXP USA Inc. establishes new performance benchmarks in the Embedded - Microprocessors sector, architected for AI-powered edge computing solutions. This neural processing-optimized microprocessor combines heterogeneous computing with advanced thermal management, delivering unprecedented TOPS/Watt efficiency for deep learning inference at the edge.Featuring a MPC8xx neural engine, this SoC achieves optimal tensor processing performance while maintaining power budgets critical for always-on AI applications.With 1 Core, 32-Bit architecture, the processor enables parallel execution of multiple neural networks while maintaining cache coherency across compute domains.Operating at 50MHz, the device meets the real-time processing requirements of convolutional neural networks in vision-based industrial inspection systems.The Communications; CPM neural accelerators deliver 16-bit floating point performance optimized for AI inference tasks.The DRAM memory subsystem provides the bandwidth necessary for weight streaming in large-scale neural network implementations.No GPU cores accelerate both traditional rendering and neural network preprocessing tasks simultaneously.10Mbps (1) connectivity enables distributed AI processing across edge nodes with precise time synchronization.The USB 1.x (1) interfaces support high-speed data acquisition from industrial cameras and sensors for machine vision applications.Designed with 3.3V tolerant I/Os, the device maintains signal integrity when interfacing with various industrial sensor networks.Rated for -40°C ~ 95°C (TA) operation, the processor reliably functions in uncontrolled edge computing environments.The 256-BBGA package incorporates advanced heat spreading technology for sustained AI workloads.Available in 256-PBGA (23x23), the device supports both conventional and high-density interconnect PCB designs.
Product Attributes
- Product Status: Obsolete
- Core Processor: MPC8xx
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 50MHz
- Co-Processors/DSP: Communications; CPM
- RAM Controllers: DRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: 10Mbps (1)
- SATA: -
- USB: USB 1.x (1)
- Voltage - I/O: 3.3V
- Operating Temperature: -40°C ~ 95°C (TA)
- Security Features: -
- Package / Case: 256-BBGA
- Supplier Device Package: 256-PBGA (23x23)
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