MPC8245LVV266D
NXP USA Inc.
MPC8245LVV266D
NXP USA Inc.
IC MPU MPC82XX 266MHZ 352TBGA
Reference Price (USD)
1+
$67.14000
500+
$66.4686
1000+
$65.7972
1500+
$65.1258
2000+
$64.4544
2500+
$63.783
Exquisite packaging
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MPC8245LVV266D
$67.14
Product details
NXP USA Inc.'s MPC8245LVV266D revolutionizes the Embedded - Microprocessors market with its 5G-optimized architecture, tailored for next-generation communication infrastructure. This high-performance microprocessor combines advanced signal processing with ultra-low latency characteristics, enabling breakthrough performance in baseband processing applications.The PowerPC 603e core architecture delivers the instruction-level parallelism required for efficient baseband processing in 5G NR systems.With 1 Core, 32-Bit configuration, the processor achieves optimal resource utilization for massive MIMO processing workloads.Operating at 266MHz, the device meets the stringent timing requirements of 5G fronthaul and midhaul interfaces.High-bandwidth SDRAM memory interfaces support the massive data flows characteristic of 5G signal processing.No graphics capabilities enable visualization of network performance metrics in real-time.3.3V tolerant I/Os ensure reliable operation in electrically noisy base station environments.Rated for 0°C ~ 105°C (TA) operation, the processor maintains performance in outdoor radio unit installations.The 352-LBGA package design optimizes thermal performance for continuous high-load operation.Available in 352-TBGA (35x35), the device supports high-reliability PCB manufacturing processes.
Product Attributes
- Product Status: Obsolete
- Core Processor: PowerPC 603e
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 266MHz
- Co-Processors/DSP: -
- RAM Controllers: SDRAM
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 352-LBGA
- Supplier Device Package: 352-TBGA (35x35)
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