MPC755BVT350LE
NXP USA Inc.
MPC755BVT350LE
NXP USA Inc.
IC MPU MPC7XX 350MHZ 360FCBGA
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Product details
NXP USA Inc.'s MPC755BVT350LE sets new benchmarks in the Embedded - Microprocessors market segment, optimized for compute-intensive embedded applications. This system-on-chip solution integrates advanced processing cores with sophisticated power management, delivering exceptional performance-per-watt characteristics for energy-conscious designs.The PowerPC architecture provides deterministic execution of real-time tasks while maintaining low power consumption, making it particularly suitable for battery-powered edge computing devices.Architected with 1 Core, 32-Bit capability, the processor enables efficient task partitioning and memory bandwidth utilization in multi-threaded applications.With clock speeds up to 350MHz, the device meets the computational demands of advanced motor control algorithms and power conversion systems.The No graphics subsystem enables smooth rendering of complex graphical user interfaces without external GPU components.The 2.5V, 3.3V I/O banks offer design flexibility for interfacing with various peripheral devices in industrial control systems.Qualified for 0°C ~ 105°C (TA) operation, the processor reliably functions in outdoor telecommunications equipment and base station applications.The 360-BBGA, FCBGA package design incorporates advanced thermal management features for reliable operation in confined spaces.Offered in 360-FCPBGA (25x25), the device supports both conventional and advanced PCB assembly techniques.
Product Attributes
- Product Status: Obsolete
- Core Processor: PowerPC
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 350MHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 360-BBGA, FCBGA
- Supplier Device Package: 360-FCPBGA (25x25)
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