MPC755BPX300LE
NXP USA Inc.
MPC755BPX300LE
NXP USA Inc.
IC MPU MPC7XX 300MHZ 360FCBGA
Reference Price (USD)
1+
$153.14000
500+
$151.6086
1000+
$150.0772
1500+
$148.5458
2000+
$147.0144
2500+
$145.483
Exquisite packaging
Discount
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MPC755BPX300LE
$153.14
Product details
NXP USA Inc.'s MPC755BPX300LE revolutionizes the Embedded - Microprocessors market with its 5G-optimized architecture, tailored for next-generation communication infrastructure. This high-performance microprocessor combines advanced signal processing with ultra-low latency characteristics, enabling breakthrough performance in baseband processing applications.The PowerPC core architecture delivers the instruction-level parallelism required for efficient baseband processing in 5G NR systems.With 1 Core, 32-Bit configuration, the processor achieves optimal resource utilization for massive MIMO processing workloads.Operating at 300MHz, the device meets the stringent timing requirements of 5G fronthaul and midhaul interfaces.No graphics capabilities enable visualization of network performance metrics in real-time.2.5V, 3.3V tolerant I/Os ensure reliable operation in electrically noisy base station environments.Rated for 0°C ~ 105°C (TA) operation, the processor maintains performance in outdoor radio unit installations.The 360-BBGA, FCBGA package design optimizes thermal performance for continuous high-load operation.Available in 360-FCPBGA (25x25), the device supports high-reliability PCB manufacturing processes.
Product Attributes
- Product Status: Obsolete
- Core Processor: PowerPC
- Number of Cores/Bus Width: 1 Core, 32-Bit
- Speed: 300MHz
- Co-Processors/DSP: -
- RAM Controllers: -
- Graphics Acceleration: No
- Display & Interface Controllers: -
- Ethernet: -
- SATA: -
- USB: -
- Voltage - I/O: 2.5V, 3.3V
- Operating Temperature: 0°C ~ 105°C (TA)
- Security Features: -
- Package / Case: 360-BBGA, FCBGA
- Supplier Device Package: 360-FCPBGA (25x25)
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