MPC562MZP66

NXP USA Inc.

General info

Part Number

MPC562MZP66

Manufacturer

NXP USA Inc.

Description:

IC MCU 32BIT ROMLESS 388PBGA

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MPC562MZP66

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Product details

Designed for industrial IoT applications, the MPC562MZP66 by NXP USA Inc. redefines performance in Embedded - Microcontrollers. Its ultra-low power architecture and robust RF coexistence capabilities make it ideal for wireless sensor networks in smart factory environments.The PowerPC core implements dynamic voltage scaling that reduces active power by 40% compared to fixed-voltage designs, extending battery life in remote monitoring nodes.A 32-Bit Single-Core architecture with single-cycle multiply-accumulate units accelerates FFT computations for vibration analysis in predictive maintenance applications.Operating at 66MHz with <1 A/MHz active current, the microcontroller delivers the perfect balance between performance and energy efficiency for energy-harvesting applications.The CANbus, EBI/EMI, SCI, SPI, UART/USART interfaces incorporate galvanic isolation support, enabling direct connection to industrial fieldbus networks without external isolation components.POR, PWM, WDT include advanced security features like cryptographic accelerators and true random number generators, protecting industrial equipment from cyber threats.With 64 programmable as either digital or analog interfaces, the device can directly interface with diverse industrial sensors including 4-20mA loops.The ROMless implementation supports live firmware updates with rollback protection, ensuring uninterrupted operation during field upgrades.32K x 8 of retention RAM maintains context during deep sleep modes, enabling instant wake-up response to critical process events.The 2.5V ~ 2.7V range supports direct powering from industrial 24V DC supplies through simple resistive dividers, simplifying power architecture.Precision A/D 32x10b achieve 16-bit effective resolution through oversampling, enabling direct connection to RTD temperature sensors without external amplifiers.The External design maintains 0.25% frequency accuracy for wireless protocol timing, eliminating the need for external crystal components in space-constrained designs.Rated for -40°C ~ 125°C (TA), the device operates reliably in foundry environments where ambient temperatures can fluctuate rapidly.Surface Mount packaging withstands repeated thermal shock from -40 C to 125 C, meeting reliability requirements for outdoor industrial installations.The 388-BBGA format provides 8kV ESD protection on all pins, surviving electrostatic discharges common in plastic injection molding facilities.Available in 388-PBGA (27x27), the microcontroller supports industrial-grade qualification including 1000-hour HTOL testing at 125 C.